PRODUCT DETAILS

CUN.38

Tin Clad Copper Foil Tape

General Description

36 micron high tensile tin clad solderable copper foil coated with high quality electrically conductive acrylic adhesive system and protected by siliconized paper liner. Designed for electrostatic and EMI/RFI shielding, static charge draining, grounding, flexible circuit boards, coils and transformers. 

Product features and applications

  • Good adhesion and initial tack
  • UV and ageing resistant 
  • Good malleability, oxidation and corrosion resistance
  • Electrical/Electronics industry
  • Printed circuit manufacturers and repairs
  • Automotive and aerospace industry

Technical data sheet

PRODUCT TYPE
Single coated
BACKING TYPE
Copper foil
ADHESIVE TYPE
Conductive acrylic
COLOR
LINER TYPE
LINER COLOR
BACKING THICKNESS
TOTAL THICKNESS
85 µm
PEEL ADHESION AT 180° ON STEEL
ROLLING BALL TACK
TENSILE STRENGTH
ELONGATION AT BREAK
THERMAL CLASS
SHORT TIME TEMPERATURE RESISTANCE
FLAME RETARDANCY
SHELF LIFE
NOTE 1
STANDARD LENGTH
Flame retardancy (UL.510) based on internal method.

International Harmonized Test Methods: ASTM D-1000, PSTC, EN 60454-2

All statements and information listed above regarding this product are typical values for general guidance, these data have not to be intended as conformity specification.

These suggestions are based on tests we believe reliable, but are not guaranteed for accuracy and completeness.

The user must test, evaluate and validate this product before the use, assuming risks and liability of such use.

This document may be revised without prior notice, the user who downloaded it will automatically be informed of any future revisions.

Suggested storage temperature is between 10°C and 30°C with 50% relative humidity.